

3M Re-enterable Scotchcast Resin 8882 292ml Flexible Potting and Encapsulating Compound
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€ 52,43
Global Product Code: 915-9735
SKU: RSBFF082F274

3M Re-enterable Scotchcast Resin 8882 292ml Flexible Potting and Encapsulating Compound
€ 52,43
In stock
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Description
Product Details
3M Flexible Potting and Encapsulating Compound, 292ml Volume – Re-enterable Scotchcast Resin 8882 292ml
This flexible potting and encapsulating compound is engineered for superior performance in challenging environments. The 292ml encapsulating resin offers excellent adhesion and hydrolytic stability, making it ideal for protecting buried splices in the telecommunications and electrical industries. Its re-enterable design simplifies future inspections or repairs without the hassle of excessive cleaning.
Features & Benefits
• Advanced compound technology ensures no isocyanates are present
• High adhesion promotes strong moisture protection
• Easy re-entry allows for quick access to splices and repairs
• Compatible with forced-compound techniques for efficient application
• Low viscosity improves penetration at low temperatures
• Cost-effective solution compared to standard encapsulants
• High adhesion promotes strong moisture protection
• Easy re-entry allows for quick access to splices and repairs
• Compatible with forced-compound techniques for efficient application
• Low viscosity improves penetration at low temperatures
• Cost-effective solution compared to standard encapsulants
Applications
• Used to encapsulate buried cable splices
• Suitable for electrical infrastructure subject to harsh conditions
• Ideal for securing connections in automation and electronics
• Applied in environments requiring thermal and electrical insulation
• Used as a waterproof potting material in various installations
• Suitable for electrical infrastructure subject to harsh conditions
• Ideal for securing connections in automation and electronics
• Applied in environments requiring thermal and electrical insulation
• Used as a waterproof potting material in various installations
How does the encapsulating compound handle extreme temperatures?
The compound maintains its integrity and remains stable at both high and low temperatures, ensuring consistent performance under varying conditions.
Is the application of this compound straightforward?
Yes, it accepts various application techniques, including gravity-fill and forced-compound methods, making the process efficient and user-friendly.
What cleaning is required before applying this compound?
Minimal to no cleaning is necessary, allowing for quick application even when splicing filled cables.
Are there any health risks associated with using this product?
This compound is free from isocyanates, significantly reducing the risk of allergic reactions during use.
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