MG Chemicals 832HD-25ML Epoxy Potting Compound 25 mL

 24,17

Global Product Code: 146-2865

SKU: RS55C65EBC7C

MG Chemicals 832HD-25ML Epoxy Potting Compound 25 mL

 24,17

In stock

Description

MG Chemicals 832HD-25ML Epoxy Potting Compound 25 mL

Product Details

The 832HD 1:1 Epoxy Potting and Encapsulating Compound is a two-part, economical, flowable, electronic-grade epoxy that provides excellent physical, chemical, and electrical protection. It is very easy to use due its 1:1 mix ratio and because it is room temperature curable. In its cured state, it protects electronic assemblies against corrosion, static discharges, shocks, vibrations, and mechanical impacts.

Non-corrosive
Flowable and high durability
Very high tensile and compressive strength
Easy mix ratio 1A:1B by volume
Free of solvents
1static mixer included

Specifications

Product Material Epoxy
Package Type Dual Cartridge
Package Size 25 mL
Special Properties Chemical Resistance, Harsh Resistance, Salt Water Resistance
Cure Time 24 h @ +25°C
Hardness 80 Shore D
Thermal Conductivity 0.27W/mK
Maximum Operating Temperature +150°C
Minimum Operating Temperature -40°C
Dielectric Strength 15.8 kV/mm, 400 V/mil
Physical Form Liquid
Volume Resistivity 1.4 x 10^13Ω cm
Odour Ammoniacal, Sulphurous
Viscosity Measurement 2300 (Part B) cP, 5900 (Part A) cP
Operating Temperature Range -40 → +150 °C

Additional information

Product Material

Epoxy

Package Type

Dual Cartridge

Package Size

25 mL

Special Properties

Chemical Resistance, Harsh Resistance, Salt Water Resistance

Cure Time

24 h @ +25°C

Hardness

80 Shore D

Thermal Conductivity

0.27W/mK

Maximum Operating Temperature

+150°C

Minimum Operating Temperature

-40°C

Dielectric Strength

15.8 kV/mm, 400 V/mil

Physical Form

Liquid

Volume Resistivity

1.4 x 10^13Ω cm

Odour

Ammoniacal, Sulphurous

Viscosity Measurement

2300 (Part B) cP, 5900 (Part A) cP

Operating Temperature Range

-40 → +150 °C

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