MG Chemicals 832C-375ML Translucent Epoxy Epoxy Resin Adhesive 375 ml
€ 50,19
Global Product Code: 918-4986
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Description
Product Details
MG Chemicals Epoxy Potting Compounds
The MG Chemicals two-part epoxy potting compound has been designed to protect your electronic components. The liquid electric grade 832 series epoxy protects your components against static discharges, fungus, thermal shocks, mechanical impact and vibrations.
Feature and Benefits
Impact resistant
Non-conductive
Low toxicity
Improves reliability and operational range
Non-porous, water and chemical resistant
Hard to remove
Available in different colours
Non-conductive
Low toxicity
Improves reliability and operational range
Non-porous, water and chemical resistant
Hard to remove
Available in different colours
Typical Applications
Aviation Industry
Communication Industry
Marine Industry
Car industry
Communication Industry
Marine Industry
Car industry
Note
Refer to the datasheet for more details on how to apply and applications
Caution
Due to exothermic reaction, heat cure temperatures should be at least 25% below the maximum temperature tolerated by the most fragile PCB component. For larger potting blocks, reduce heat cure temperature by greater margins
Potting Compounds
The Potting Compounds are pourable two-part compounds for potting and encapsulating electronic circuits and components. They protect against moisture and corrosion and improve insulation resistance and mechanical strength. They may be cured at room temperature, or oven cured. Use silicone oil aerosol as a mould release agent. Full instructions supplied with each pack.
Specifications
| Product Material | Epoxy |
|---|---|
| Package Type | Can |
| Package Size | 375 ml |
| Cure Time | 35 min → 24 h |
| Colour | Translucent |
| Maximum Operating Temperature | +145°C |
| Minimum Operating Temperature | -30°C |
| Operating Temperature Range | -30 → +145 °C |
| Physical Form | Liquid |
| Setting Time | 60min |
| Chemical Composition | Alkyl Glycidyl Ether, Bisphenol A, C18-Unsaturated, Dimers, Epoxy Resin, Fatty Acids, Reaction Products with Polyethylenepolyamines, Triethylenetetramine |
| Viscosity Measurement | 3300cP/s |
Additional information
| Product Material | Epoxy |
|---|---|
| Package Type | Can |
| Package Size | 375 ml |
| Cure Time | 35 min → 24 h |
| Colour | Translucent |
| Maximum Operating Temperature | +145°C |
| Minimum Operating Temperature | -30°C |
| Operating Temperature Range | -30 → +145 °C |
| Physical Form | Liquid |
| Setting Time | 60min |
| Chemical Composition | Alkyl Glycidyl Ether, Bisphenol A, C18-Unsaturated, Dimers, Epoxy Resin, Fatty Acids, Reaction Products with Polyethylenepolyamines, Triethylenetetramine |
| Viscosity Measurement | 3300cP/s |
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