Acc Silicones 520005402 Silicone Potting Compound 2 L
€ 343,35
Global Product Code: 194-4684
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Description
Product Details
SILCOTHERM 2 Part Addition cure silicone encapsulant
Thermally conductive
Low modulus
1:1 Mix Ratio
Low modulus
1:1 Mix Ratio
Specifications
| Trade Name | QSil 553 |
|---|---|
| Product Material | Silicone |
| Package Type | Kit |
| Package Size | 2 L |
| Special Properties | Thermal Conductivity |
| Cure Time | 24 h @ 25 °C, 7 min @ 100°C |
| Thermal Conductivity | 0.68W/mK |
| Maximum Operating Temperature | +260°C |
| Minimum Operating Temperature | -55°C |
| Physical Form | Viscous Liquid |
| Operating Temperature Range | -55 → +260 °C |
| Volume Resistivity | 4.02E+14Ω cm |
| Viscosity Measurement | 6000mPa/s |
Additional information
| Trade Name | QSil 553 |
|---|---|
| Product Material | Silicone |
| Package Type | Kit |
| Package Size | 2 L |
| Special Properties | Thermal Conductivity |
| Cure Time | 24 h @ 25 °C, 7 min @ 100°C |
| Thermal Conductivity | 0.68W/mK |
| Maximum Operating Temperature | +260°C |
| Minimum Operating Temperature | -55°C |
| Physical Form | Viscous Liquid |
| Operating Temperature Range | -55 → +260 °C |
| Volume Resistivity | 4.02E+14Ω cm |
| Viscosity Measurement | 6000mPa/s |
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